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· 9 jun, 2025

Conductive Adhesives: Properties, Types, and Applications

Conductive adhesives are specialized materials that combine the bonding properties of adhesives with electrical conductivity. These adhesives play a critical role in modern electronics, offering a reliable and efficient alternative to traditional soldering. They are especially valuable in situations where heat-sensitive components or delicate circuits are involved, providing a versatile solution in a variety of industries, from automotive to consumer electronics.

What Are Conductive Adhesives?

Conductive adhesives are adhesives that contain conductive materials, such as silver, copper, or carbon, which allow them to conduct electricity. These adhesives are designed to form strong, permanent bonds between electronic components, while simultaneously enabling electrical connectivity between those components. Unlike conventional adhesives that insulate, conductive adhesives serve dual purposes: they bond and provide electrical pathways.

They are commonly used as an alternative to soldering in electronics assembly, particularly in sensitive or intricate applications where heat and mechanical stress may cause damage. These adhesives can also be used for bonding components onto substrates or for forming conductive pathways in flexible and printed circuit boards.

Types of Conductive Adhesives

  1. Anisotropic Conductive Adhesives (ACAs):
    • Definition: Anisotropic conductive adhesives are materials that only conduct electricity in one direction, making them ideal for use in applications where directional conductivity is required.
    • Structure: These adhesives contain conductive particles suspended in a thermosetting or thermoplastic resin. The conductive particles form electrical contacts when pressure is applied, but the resin itself remains insulating.
    • Applications: ACAs are commonly used for attaching flip-chip devices, connectors, and ICs to flexible circuits, where directional conductivity is necessary to avoid short circuits.
  2. Isotropic Conductive Adhesives (ICAs):
    • Definition: Unlike ACAs, isotropic conductive adhesives offer electrical conductivity in all directions. The conductive particles are uniformly distributed throughout the adhesive, allowing the adhesive to conduct electricity in any orientation.
    • Structure: These adhesives are typically filled with conductive particles like silver, copper, or graphite dispersed in a polymer matrix.
    • Applications: ICAs are used in applications like bonding components to PCBs (printed circuit boards), LED assemblies, and sensors where uniform conductivity is required.
  3. Silver-Based Conductive Adhesives:
    • Definition: These adhesives contain silver particles as the conductive material. Silver has excellent conductivity and is often used in high-performance applications.
    • Structure: These adhesives typically consist of a silver filler in a resin binder, and the amount of silver determines the adhesive’s conductivity and strength.
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Pregunta
· 9 jun, 2025

Protocol Error between the Web Gateway and InterSystems IRIS

I have created a new docker stack with webgateway and IRIS for Health 2025.1. I have mapped the posts of wegateway like this:

  • 8743:443
  • 8780:80

I can access IRIS portal through 8743 without problems.

I also have created a FHIR repository, and I'm able to access it through 8743 port.

I have a web application, in another server with another domain, that connects to this FHIR repository. I have configured in FHIR endpoint the allowed origin to the domain of this application. But when I try to connect from this application to FHIR repository I have this error on Webgateway:

Protocol Error between the Web Gateway and InterSystems IRIS

This is a second instance that I'm configuring, with the first one I didn't see this error. Could this be because first instance runs in 8443 port? Or maybe it is because 2025.1 version? I don't know what to do...

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Pregunta
· 9 jun, 2025

Issue with Data Transformation: OML^O21 to ORM^O01

Hi All,

I am trying to build a very basic data transformation to convert messages from OML^O21 to ORM^O01. However, I'm unable to loop through multiple ORC segments.When I use the source document type 2.5: OML_O21, I am not able to loop through multiple lines of the ORC segment.Interestingly, if I use the source document type 2.3: ORM_O01, I am able to loop through multiple ORC segments successfully.I am currently using the following data transformation logic:

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Resumen
· 9 jun, 2025

InterSystems 开发者出版物,六月 02 - 08, 2025,摘要

六月 02 - 08, 2025Week at a GlanceInterSystems Developer Community